TSMC held its 17th annual Supply Chain Management forum on Dec. 7, 2017 to show appreciation for the support and contributions of its suppliers over the past year, particularly in 10nm capacity ramp and technology development in 7nm and beyond. Over 700 suppliers around the world in the fields of equipment, materials, packaging, testing, facilities, IT systems and services, and environmental and waste management services participated in the forum.
"This is an exciting time of innovation for the semiconductor industry, with new applications for silicon emerging one after another,"said TSMC Co-Chief Executive Officer Dr. Mark Liu. "TSMC looks forward to even closer collaboration with our supplier partners to enable these innovations and create a better, more intelligent world for the future."
"With the support of our supplier partners, TSMC has once again brought a new technology to volume production in record time with our 10nm capacity," said TSMC Senior Vice President and Chief Information Officer Dr. Steve Tso. "For this, as well as many achievements together throughout 2017, we extend our heartfelt thanks and hope to continue working side by side to drive technology forward."
Twelve outstanding suppliers were recognized by TSMC for their performance, as follows:
Excellent Performance Award
| Col title 1 Col title 2 | Col title 3 Col title 4 | ||
|---|---|---|---|
 | Applied Materials, Inc. Technology Collaboration |  | Fujifilm Electronic Materials Co., Ltd. CMP Material |
 | ASM International N.V. CVD Equipment |  | HOYA Corporation Mask Blank Material |
 | ASML Innovation and Collaboration on EUV |  | Shin-Etsu Hantodai Co., Ltd. Raw Wafer Material |
 | EBARA Corporation CMP Equipment |  | SUMCO Corporation Raw Wafer Material |
 | Hitachi Kokusai Electric Inc. Furnace Equipment |  | Tokyo Ohka Kogyo Lithography Material |
 | LAM Research Corporation Etch Equipment | ||
 | Tokyo Electron Limited Production Ramp Support | ||
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