TSMC Debuts "Laser Positioning and Measurement System" to Empower Supply Chain Digital Transformation

TSMC is deeply rooted in a culture of quality, and has established a comprehensive quality management system across four key pillars: supply chain management, technology development, wafer manufacturing, and customer service. By sharing its extensive expertise, TSMC leads its partners toward collective growth. To manage 2.6 million clean spare parts and 35 million measurement data points each year, TSMC has collaborated with suppliers to launch the "Laser Positioning and Measurement System." By replacing physical jigs with non-contact laser technology, the system ensures high cleanliness and structural integrity while overcoming the limitations of single-specification fixtures. This transforms measurement processes into a multi-purpose digital universal platform. The scope of laser positioning measurement is estimated to cover approximately 90% of spare parts, potentially eliminating the use of 1,000 physical jigs. As of June 2026, four spare part cleaning suppliers have successfully adopted the system, reducing consumption by about 600 physical jigs. This initiative demonstrates quality-driven waste reduction at the source while enhancing overall supply chain operational resilience.  

Because the cleanliness of semiconductor spare parts is critical to wafer yield, TSMC conducts rigorous post-cleaning verification to mitigate process risks such as structural micro-damage or molecular residue. These inspections cover dimensional specifications, micro-particles, and surface roughness to ensure that parts are precisely re-installed onto equipment in a damage-free and contamination-free state. In response to the stringent requirements of advanced processes, TSMC began implementing laser positioning measurement in 2025 to strengthen the quality management capabilities of cleaning suppliers. By guiding suppliers to integrate advanced positioning technology into existing measurement platforms, the system utilizes lasers for precise point calibration. This not only improves the accuracy of dimensional inspections but also maintains high cleanliness standards throughout the measurement process, establishing a more rigorous and reliable line of defense for advanced manufacturing processes.

A culture of excellence in quality is the key to TSMC's sustainable competitiveness. By adopting the "Laser Positioning and Measurement System," the Company not only assists spare parts cleaning suppliers in their digital transformation but also fulfills its green commitment to waste reduction at the source as well as resource optimization. Building on this foundation, TSMC internalizes high-quality standards into the operational DNA of the supply chain. Through ongoing empowerment and innovation, the Company collaborates with partners to build a resilient and sustainable semiconductor ecosystem.

• What is the "jig" used in semiconductor component cleaning and measurement, and what is its primary function?

A jig is a physical auxiliary tool used to assist in precisely positioning and securing components during measurement or processing, ensuring standardized inspection results while maintaining high precision.  

• What is United Nations Sustainable Development Goals (SDGs) Goal 12?

The 17 goals set forth by the United Nations urge collaborative efforts from governments, industries, and academia worldwide to achieve sustainable development across social, economic, and environmental dimensions by the year 2030. SDGs 12 is "ensure sustainable consumption and production patterns."