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An Innovation Pioneer

As the world's largest dedicated IC foundry, TSMC works with customers to accelerate and unleash innovation through its pioneering business model and robust R&D capabilities to drive infinite possibilities in technological progress and sustainable developments through the ubiquitous semiconductor.
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Patent applications globally / trade secrets registered
Innovative testing methods developed for quality and reliability to enhance product, technology and quality
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Provide customers process technologies / advanced packaging technologies

Our Senior Executives

Focusing on Innovation

In an era of rapid change, TSMC continues to innovate while upholding the core value of Customer Trust, providing advanced technologies and productivity to strengthen cooperation with customers, help customers find success, and create win-win outcomes.

Semiconductors are at the core of modern technological innovation and continue to drive advancement in our lives. We are committed to building meaningful partnerships with our customers around the world and developing a sustainable technology roadmap. Together, we provide eco-friendly products that are more powerful and more energy efficient.

In face of the highly complex production models of globalized manufacturing, TSMC has been able to consistently inject innovations into intelligent manufacturing, enhance operational efficiency, and provide high-quality sustainable products to achieve ecological efficiency through intelligent manufacturing.

Technology leadership is one of the key cornerstones enabling TSMC's continuous growth. We are committed to fostering an open and innovative, as well as diverse and inclusive environment and realizing digital transformation in the R&D organization to unleash employees' full potential and achieve the goal of corporate sustainability.

We uphold our vision of sustainability by joining hands with customers and suppliers for progress. TSMC works closely with customers and suppliers on quality and service to pursue perfection and pave the way for industry progress.

TSMC endeavors to collaborate with our ecosystem partners on the Open Innovation Platform® to deliver state-ofthe- art design solutions. Furthermore, the new 3DFabric Alliance will strive to develop 3D silicon stacking and advanced packaging to facilitate the continuous innovation of global technology.

In an era of rapid change, TSMC continues to innovate while upholding the core value of Customer Trust, providing advanced technologies and productivity to strengthen cooperation with customers, help customers find success, and create win-win outcomes.
Dr. Cliff Hou
Senior Vice President, Europe & Asia Sales, and Deputy Co-COO
Semiconductors are at the core of modern technological innovation and continue to drive advancement in our lives. We are committed to building meaningful partnerships with our customers around the world and developing a sustainable technology roadmap. Together, we provide eco-friendly products that are more powerful and more energy efficient.
Dr. Kevin Zhang
Senior Vice President, Business Development and Overseas Operations Office, and Deputy Co-COO
In face of the highly complex production models of globalized manufacturing, TSMC has been able to consistently inject innovations into intelligent manufacturing, enhance operational efficiency, and provide high-quality sustainable products to achieve ecological efficiency through intelligent manufacturing.
Dr. Y.L. Wang
Vice President, Operations / Fab Operations I
Technology leadership is one of the key cornerstones enabling TSMC's continuous growth. We are committed to fostering an open and innovative, as well as diverse and inclusive environment and realizing digital transformation in the R&D organization to unleash employees' full potential and achieve the goal of corporate sustainability.
Dr. Michael Wu
Vice President, Research & Development / Platform Development
We uphold our vision of sustainability by joining hands with customers and suppliers for progress. TSMC works closely with customers and suppliers on quality and service to pursue perfection and pave the way for industry progress.
Dr. Jun He
Vice President, Quality and Reliability and Operations / Advanced Packaging Technology and Service
TSMC endeavors to collaborate with our ecosystem partners on the Open Innovation Platform® to deliver state-ofthe- art design solutions. Furthermore, the new 3DFabric Alliance will strive to develop 3D silicon stacking and advanced packaging to facilitate the continuous innovation of global technology.
Dr. L.C. Lu
TSMC Fellow and Vice President, Research & Development / Design & Technology Platform

Our Focus Issues

Learn How We

Pursue Innovation

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An Innovation Pioneer

2022 Sustainability Report
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Quality Policy and Certificates

Read More About TSMC's Quality Policy and ISO, IATF, IECQ Related Certificates
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2022 TSMC UN SDGs Action Report

Learn How TSMC Exerts Its Ambition to Accelerate the Fulfillment of SDGs
Read More