TSMC Donates Advanced Electron Microscope to NTHU, Bridging Industry and Academia

As part of its commitment to the "Develop Talent" pillar of the five ESG Directions, TSMC actively partners with universities and research institutions in Taiwan and around the world. Through the four focus areas of "science outreach, career exploration, professional development, and collaborative research," the Company strengthens industry-academia collaboration, advancing research in cutting-edge technologies including semiconductor materials, devices, manufacturing processes, and chip design. To deepen advanced research and bridge the gap between academic learning and practical application, TSMC donated a high-resolution Transmission Electron Microscope (TEM) in May 2026 to the Department of Materials Science and Engineering at National Tsing Hua University (NTHU)—the first department of its kind established in Taiwan, extending advanced R&D resources from Ph.D. research to master's and undergraduate students, empowering young minds to engage in hands-on TEM training early on and cultivating practical talent from the grassroots level. TSMC has also established a systematic workflow covering "installation planning and relocation" to ensure the successful commissioning of the equipment. Additionally, TSMC launched a summer internship program in July providing college students with real-world industry experience, helping them develop professional skills, and fostering the next generation of talent for the semiconductor industry.

TSMC remains committed to advancing collaboration with academia and supporting joint development projects (JDPs) in semiconductor circuit design, advanced semiconductor devices, process technologies, and manufacturing methods. Since 2021, TSMC's Quality and Reliability organization has launched 27 collaborative research projects with National Taiwan University, National Yang Ming Chiao Tung University, National Tsing Hua University, National Cheng Kung University, National Central University, National Chung Hsing University, and Taipei Medical University, covering fields such as materials science, physics, mechanical engineering, electronics, chemistry, and biomedical science. In an era of relentless node scaling, angstrom-scale TEM imaging is indispensable for characterizing next-generation materials and structures. To support high-level academic analysis, the TEM Lab under TSMC's Quality and Reliability organization will thoroughly overhaul and donate a phased-out TEM to NTHU. Beyond benefiting approximately 200 materials science students annually, the donation will expand the university's monthly machine capacity from 480 to 720 hours, helping future talents master practical skills and enable breakthrough scientific discoveries.

Relocating precision instruments requires meticulous planning. To ensure the donated equipment delivers maximum scientific value, TSMC established a support framework spanning installation planning and relocation. Recognizing that TEMs are highly sensitive to environmental variables such as vibration, electromagnetic interference (EMI), temperature, and humidity, TSMC partnered with the original equipment manufacturer's technical team. Over a three-month period, they co-developed a customized relocation protocol, including conducting rigorous on-site testing of micro-vibrations, EMI, temperature, and humidity within the campus facility, and benchmarking and recording core operational parameters to install customized electromagnetic shielding tailored to the new site. This ensured the environment met the stringent requirements of high-precision instrumentation, and guaranteed consistent analytical performance before and after relocation. In addition, the team applied nitrogen-purged hermetic sealing to critical components to prevent moisture contamination, protect against component damage from thermal shock, and mitigate transport risks.

Deepening industry-academia collaboration is central to TSMC's long-term commitment to nurturing future technology leaders. Through this TEM donation and dedicated technical guidance, TSMC is not only helping NTHU advance its frontier research in novel materials, but also driving critical breakthroughs in semiconductor manufacturing, advanced packaging, and next-generation materials development. This initiative establishes a powerful virtuous cycle—where real-world industry expertise enriches academic learning, and university research breakthroughs fuel industrial innovation—ultimately strengthening the talent pipeline of the global semiconductor ecosystem.

• What is TSMC's "Enhance Industry-academia Collaboration" strategy?
  TSMC links academic institutions in Taiwan and overseas by investing resources in campus programs based on a long-term mechanism for interaction to cultivate the next generation of semiconductor talent.
  
  
• What is United Nations Sustainable Development Goals (SDGs) Goal 4?
  The 17 goals set forth by the United Nations urge collaborative efforts from governments, industries, and academia worldwide to achieve sustainable development across social, economic, and environmental dimensions by the year 2030. SDGs 4 is "ensure inclusive and equitable quality education and promote lifelong learning opportunities for all."
  
  
• What is United Nations Sustainable Development Goals (SDGs) Goal 8?
  The 17 goals set forth by the United Nations urge collaborative efforts from governments, industries, and academia worldwide to achieve sustainable development across social, economic, and environmental dimensions by the year 2030. SDGs 8 is "promote sustained, inclusive and sustainable economic growth, full and productive employment and decent work for all."