TSMC Debuts A13 Process at Technology Symposium to Expand AI

At its 32^nd Technology Symposium in 2026, themed "Expanding AI with Leadership Silicon," TSMC continued to extend its technology leadership with the debut of its next-generation A13 logic process technology. Compared to A14, A13 not only reduces die area by 6% but also features fully compatible design rules. This enables customers to upgrade to the latest nanosheet transistor technology with lower design migration costs, while further improving power efficiency and performance through continuous design-technology co-optimization (DTCO). A13 is scheduled for volume production in 2029.

In addition to advanced processes, TSMC unveiled its latest advancements in TSMC 3DFabric® advanced packaging and 3D silicon stacking solutions, as well as specialty technologies to meet the demands of next-generation artificial intelligence (AI) and high-performance computing (HPC). This year's symposium also featured an ESG-themed booth for the first time. Under the theme "Driven by Tech, Built for Sustainability," it showcased TSMC's commitment to driving positive environmental and social impact through its technology leadership and manufacturing excellence. Overall, the TSMC 2026 Technology Symposium attracted a record-breaking number of over 9,100 participants globally (in person and virtually), demonstrating continued strong customer support for the Company.

TSMC drives industry innovation through its Technology Symposiums. This year's Japan Technology Symposium focused on automotive chiplet system-on-chip (SoC) development, featuring an "Automotive Talk" where the Company engaged with an industry expert through interactive Q&A sessions to build forward-looking momentum for the automotive industry. Additionally, the fourth "Innovate with TSMC!" event series, tailored for startup customers, brought back its "Customer Pitch" and "Demo Zone" events to foster real-time exchange among emerging customers, venture capitalists, and Value Chain Alliance (VCA) partners. The "Customer Pitch" sessions in North America and Europe invited 17 startup customers to present their product roadmaps, while the "Demo Zone" in North America, Europe, and China gathered 42 customers to showcase diverse end-products powered by TSMC's advanced technologies. Together, these three events attracted over 2,200 visitors, 70 investment experts, and 10 VCA partners, fueling growth momentum for startups worldwide.

While driving global technological innovation, TSMC also integrated sustainability and care for the community into its Taiwan Technology Symposium. In 2026, the Company established its first-ever ESG-themed booth to showcase three green product case studies featured in its Sustainability Reports: a Bluetooth® Low Energy continuous glucose monitoring chip, a RAIN RFID tag chip that improves medical logistics tracking efficiency, and a high-performance server processor that balances high-performance compute with a low carbon footprint. These examples highlighted the leading technologies TSMC used to help customers unleash sustainable value. Additionally, the event promoted TSMC's sustainability initiatives through an interactive "Play Games, Win Sustainable Gifts" activity. Participants received a "Low-Altitude Species Harmony Soap," featuring design elements from the "Eco Plus! Ecological Harmony Program" and infused with cogongrass extract, a key grass species found in the habitat of the eastern grass owl. Through this edutainment approach, TSMC demonstrated its long-term commitment to biodiversity and its pledge to foster shared environmental well-being.

As AI expands from data centers to edge devices, semiconductors have become the core engine driving technological transformation. TSMC will continue to invest in semiconductor technology development and system integration solutions, while remaining committed to green manufacturing and expanding its global manufacturing footprint. Together with customers, TSMC accelerates product innovation to co-create a smart and sustainable future. For more information on innovative achievements and keynote speeches, please refer to the TSMC 2026 Technology Symposium video website.

• What is United Nations Sustainable Development Goal 9?

The United Nations adopted 17 Sustainable Development Goals, calling on governments, businesses, academia, and society to work together to achieve sustainable development across social, economic, and environmental dimensions by 2030. SDG 9 focuses on "building resilient infrastructure, promoting inclusive and sustainable industrialization, and fostering innovation."

• What were the highlights of TSMC's 32^nd Technology Symposium in 2026?

TSMC's 32^nd Technology Symposium in 2026 was held under the theme "Expanding AI with Leadership Silicon." At the event, TSMC unveiled its next-generation A13 advanced logic process, and shared the latest progress on A12, N2U, TSMC 3DFabric® advanced packaging, automotive technologies, and specialty technologies. The symposium attracted more than 9,100 participants both in person and online, setting a new record amid strong interest from customers and industry partners in TSMC's technology roadmap and continued innovation.

• Why did TSMC establish an ESG-themed booth at the Technology Symposium?

In 2026, TSMC established an ESG-themed booth at its Taiwan Technology Symposium for the first time. Under the theme "Driven by Tech, Built for Sustainability," the booth showcased three green product case studies featured in TSMC's Sustainability Reports. Through technology demonstrations and sustainability case studies, TSMC illustrated how semiconductor innovation can help customers create positive environmental and social value.