TSMC Innovates Test Circuit Design to Boost Analysis Efficiency by 70%

Strengthening quality capabilities is a crucial pillar of technology leadership. In response to the increasing complexity of semiconductor manufacturing processes, TSMC actively invests in research and development of testing technologies. By optimizing the design of test circuits embedded in chips, the Company has significantly enhanced the efficiency of failure analysis for its R&D teams. This innovation enables rapid identification of potential risks in chips and processes, reducing the time required for failure analysis in laboratories. Moreover, the optimized design is also applied to manufacturing processes for detection and analysis, shortening the learning curve for new manufacturing processes and accelerating yield improvement. As of September 2025, the efficiency of failure analysis has increased by an average of over 70%, demonstrating the Company's commitment to leveraging innovative approaches to raise the effectiveness of quality management. 

Improved Circuit Design to Overcome Failure Localization Challenges

Test circuits play a critical role in semiconductor manufacturing processes, assisting R&D teams in detecting failures and identifying process weaknesses during the initial chip prototyping stages. These circuits enable developers to refine development workflows. However, as the scale and complexity of transistors and interconnects within test circuits continue to grow, the challenges of failure localization also increases. To address this, TSMC adopted a design enhancement strategy that incorporates the concept of failure analysis to comprehensively optimize test circuits. The original circuit layout featuring large unordered patterns is transformed into orderly small patterns, enabling rapid and precise failure localization while meeting testing requirements. This design is not only applied in laboratories but also deployed across manufacturing lines, enabling detection and failure analysis operations directly on production lines, improving production efficiency and product quality.

TSMC, with its relentless pursuit of excellence in quality culture at its core, has achieved dual enhancements in chip quality and process efficiency through the improvement of test circuit design. This ongoing effort strengthens its competitive edge in technology leadership, driving technological advancements and unlocking infinite possibilities for sustainable development.