Actively working with its supply chain in green chemical management, TSMC conducts training, auditing, and coaching for suppliers on hazardous substance management based on the Company’s 'Supplier Sustainability Standards' to ensure that chemicals used in production meet international standards and customer expectations. To further enhance the green manufacturing capabilities of the supply chain, TSMC launched the "Chemical Mechanical Polishing (CMP) Pad Transformation Project" in 2023 and collaborated with suppliers to assess substitute materials for "chlorinated pore filler," a raw material in CMP pads. A chlorine-free polishing pad formula, confirmed to have no impact on process quality and safety, was then successfully developed. By 2024, validation of the alternative process was completed, and as of December, the new pad was implemented in Fab 12A, Fab 14A, Fab 14B, and Fab 20, achieving both environmental and quality advantages.

Providing of Material Analysis Resources, and Enhancing Suppliers’ Capabilities

Pore filler serves as the primary raw material for CMP pad production. One of its constituents is listed as a Substance of Very High Concern (SVHC) by the EU's REACH regulation due to its chlorine formula. Aiming to protect human health and support environmental sustainability, TSMC collaborates with its suppliers of pore filler and polishing pads to develop chlorine-free pore filler CMP pads. The analyses focused on the components, sizes, and expansion properties of existing chlorinated pore fillers. In line with the requirements of advanced process technology, TSMC labs support suppliers in improving their metal and chemical analysis capabilities. This allows for more precise identification of differences among alternative materials, serving as a basis for adjusting production parameters for polishing pads and developing diverse chlorine-free pore filler formulas. A series of combination tests were performed with nearly 90 different types of CMP pads to determine the most compatible pore fillers, achieving the goal of optimizing the chlorine-free pore filler pad process. Moreover, TSMC requires CMP pad suppliers to incorporate the size of pore filler into their standard inspection for incoming material quality control. Suppliers implement statistical process control (SPC) methods for quality management, and combine multi-factor and fingerprinting analysis to validate process parameters and analyze sources of variation for the first time. These actions ensure that the chlorine-free pore filler CMP pads meet semiconductor process specifications and standards for production stability.

Enhancing suppliers' manufacturing standards and sustainable operations is fundamental to TSMC's responsible supply chain practices. Adhering to the promise of hazardous substance management, TSMC expects to replace CMP pads across all domestic and overseas facilities by the end of 2026, strengthening its green manufacturing to promote industrial safety and environmental sustainability.

Timeline for Promoting Chlorine-free CMP Pads