:::
Si rod becomes Si wafer after slicing process, and the quality control of it is critical to flatness performance.
Traditional slicing method cuts the Si rod with SiC slurry.
DCW slices using diamond wire and water, which reduces the carbon emission during the process.
Si rod becomes Si wafer after slicing process, and the quality control of it is critical to flatness performance.

Related Cases

StayConnected
Stay
Connected
Subscribe ESG Newsletter