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Si rod becomes Si wafer after slicing process, and the quality control of it is critical to flatness performance.
Traditional slicing method cuts the Si rod with SiC slurry.
DCW slices using diamond wire and water, which reduces the carbon emission during the process.
Si rod becomes Si wafer after slicing process, and the quality control of it is critical to flatness performance.

Driven by the ESG vision of "uplifting society", TSMC encourages employees to propose ideas that connect with TSMC’s five ESG directions through the TSMC ESG AWARD to embed sustainability into daily operations. One award-winning idea in the third TSMC ESG AWARD, “Diamond Wire Sawing Realizes Green Manufacturing”, was launched in 2022. Under the premise of not affecting existing process quality, TSMC collaborated with a silicon (Si) wafer supplier and successfully sliced 8-inch Si wafers using Diamond Cutting Wire (DCW). The method has been verified and introduced into Fab 5 and Fab 6. After verification in Fab 3, Fab 8, and Fab 10, TSMC expects that each year silicon carbide (SiC) slurry consumption will be reduced by 6,000 kgs, and carbon emissions will decline by 294 tons, realizing the missions of driving green manufacturing and building a responsible supply chain.

Slicing the Si Wafer by Diamond Wire and Water can Reduce the Carbon Footprint

In the conventional method, Si ingots are cut into rods, then sliced into wafers using copper wire and SiC slurry. To reduce the carbon footprint of SiC slurry production and recycling, TSMC has collaborated with a Si wafer supplier to develop a slurry-free slicing technique to promote environmental sustainability and strengthen green operations. By replacing the traditional slicing method with DCW, carbon emissions from production and recycling of the process material can be reduced by more than 90%. Moreover, to balance both quality and environmental friendliness, TSMC not only confirmed the Certificate of Assurance (CoA) of the material from the supplier, but assisted with its trial application in the Company’s 8-inch wafer fabs, ensuring through repeated testing and adjustments that the flatness of Si wafers meet the requirements of semiconductor manufacturing.

Technical Difference between Traditional Slicing (SiC Slurry) and DCW
TSMC Joins Hands with Supplier to Realize Green Silicon Wafer Manufacturing for Environmental Protection and Carbon Reduction

Adhering to our vision of sustainable development, TSMC collaborates with suppliers to achieve environmentally friendly silicon wafer manufacturing and creates a green and low-carbon supply chain.

M.D. ChenDirector of Corporate Analytical Laboratories at TSMC

As a part of the semiconductor value chain, besides striving to reduce the environmental impact of production, developing environmentally friendly processes that achieve carbon and waste reduction is a key driver for promoting sustainable development.

Yin-Sheng ShuehPresident of Taisil Branch, GlobalWafers Co., Ltd.

To maximize green benefits, TSMC is adopting 8-inch wafers sliced with DCW, and is continuing to collaborate with our supplier to evaluate DCW for cutting 12-inch wafers. Following the supplier’s installation of a 12-inch DCW tool, TSMC plans to begin verification by the end of 2024. After full implementation, TSMC expects annual SiC slurry consumption to be reduced by about 130 tons and carbon emissions to decline by 5,450 tons, creating sustainable value for the industry.

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