TSMC Builds a High-quality Work Environment for Contractors and Improves Job Quality of Transport Drivers

TSMC is committed to creating a friendly work environment. Through launching the On-site Contractor Personnel Support Program, the Company has greatly improved the health and safety of contractors’ entry-level personnel. In 2020, following the interviews with personnel working for the Company’s cleaning, food, and security services contractors, TSMC started to improve their work environment based on the interview results. Now the Company took further action to streamline work processes for tank truck and freight truck drivers to improve delivery efficiency. As of September 2021, the project has benefited over 8,700 people and provided a better workplace for the contractors.

Adjustment of Overall Wafer Transportation Process Increased Efficiency by 95%

The wafers manufactured by TSMC are collected by freight drivers at and delivered to various fabs in northern, central, and southern Taiwan on a daily basis. The average wait time for drivers at each collect point is 10-15 minutes, while the total wait time for each driver exceeds 2 hours per day. To optimize the efficiency of wafer transportation, in March 2021, TSMC’s Material Supply Chain Management Division joined the Manufacturing Department in Fab 5, which is in charge of freight trucks, to conduct a series of interviews with transport drivers to learn about their daily operations and collect information on delivery points, routes, and process. By re-planning the transportation route, establishing a schedule for each collect and delivery point, and adding parking spaces for trucks, the Company significantly shortened the daily wait time to 6-15 minutes, which not only improved the delivery efficiency by 95%, but also reduced the risk caused by driver fatigue. By August 2021, this improvement in transportation safety has been implemented across all TSMC fabs in Taiwan.

TSMC Optimizes the Wafer Transportation Process

Working to Achieve Zero Wait Time with Automated Wafer Packaging

In order to expedite the wafer delivery process, TSMC will expand the existing packaging equipment and an automated warehouse management system by the end of 2021 to complete wafer packaging ahead of schedule and reduce delays caused by manual operations. Also, an intelligent logistic system, which speeds up the entry and exit of freight trucks, is also being evaluated before installation.. Ultimately, the Company aims to achieve zero wait time for the drivers.

TSMC's Fab Contractor Care Plan