TSMC Continues to Drive Green Innovations for Advanced Process Tools, Aiming to Save 28 Million Tons of Pure Water and 1.1 Billion kWh of Electricity by 2030
With the rapid evolution of semiconductor process technology, TSMC continues to focus on innovative ways to improve energy and resource efficiency. In addition to working with suppliers to develop a “water saving control system” for FOUP cleaning tools, TSMC implemented “Tool Parameter Optimization” and "New Technology Integration" strategies to continue exploring the water and power saving opportunities for advanced process tools. As of February 2022 TSMC has successfully implemented six action plans into the controlled wafer cleaning and production machines at the 12-inch wafer GIGAFAB® facilities in Taiwan, effectively saving 10.47 million tons of pure water and 111.9 million kWh of electricity, aiming to save 28 million tons of pure water and 1.1 billion kWh of electricity by 2030.
Two Major Strategies and Six Action Plans to Improve Energy Efficiency
Facing increasingly complex process of advanced technologies, TSMC’s Intelligent Engineering Center has established a cross-organizational team to review comprehensively the water consumption of advanced process tools in 2021 and found that the water used by wet process tools accounted for more than 70% of the total consumption. Thereafter, the team further analyzed the water consumption and discharge model of the tools and developed six action plans following the two major strategies of "Tool Parameter Optimization" and "New Technology Integration" to improve energy and resource efficiency and achieve the goals of sustainable development.
TSMC's Advanced Process Equipment Water and Energy Saving Action Plan
TSMC is committed to practicing green manufacturing and continues to develop action plans to reduce water and power used in semiconductor process tools to improve energy efficiency.
Add Green Actions in the Standard Equipment Purchase Specifications to Generate Further Benefits
TSMC continues to expand the scope of water and power saving action plans and expects to gradually implement those action plans into the production tools at the 12-inch wafer GIGAFAB® facilities in Taiwan by the second quarter of 2022. The two major strategies will be included in the advanced process tools purchase specifications, making sure the related design verification and component installation to be completed before new machine move in. Aiming to save 28 million tons of water and 1.13 billion kWh of electricity by 2030, TSMC will continue to implement green actions to achieve the goal of maximizing energy and resource efficiency.