TSMC Holds Worldwide Technology Symposium and Collaborates with Customers to Speed up Innovation
In the face of the constantly changing semiconductor industry, TSMC continues to strengthen its technology leadership and advantages to help customers succeed. TSMC kicked off its annual Worldwide Technology Symposium in San Jose, USA, in April 2019, followed by Taiwan, Europe, China, and Japan during May and June of 2019, to demonstrate its breakthroughs and the latest progress in advanced technologies, special technologies, and advanced packaging technologies. As the trusted technology and capacity provider in the semiconductor industry, TSMC continues to invest in research and development to help customers speed up their innovations. A total of more than 5,800 attendees participated in the symposium, a 14% increase over 2018 to a record-high level, and showing customers’ growing interests in the event.
We will work together with our customers to bring brand new 5G experiences and revolutionary AI applications to our daily lives.
Customers around the Globe Share Successful Stories of Collaborating with TSMC in Advanced Technologies, Specialty Technologies, and Advanced Packaging Technologies









"We are seeing digital computation becoming increasingly ubiquitous today. Going forward, 5G and AI will fuel the growth of the semiconductor industry in the future. TSMC offers the most advanced and broadest technology portfolios, and relentlessly pursues manufacturing excellence. We never competed with our customers and build trusted relationships with them. We will work together with our customers to bring brand new 5G experiences and revolutionary AI applications to our daily lives," said C.C. Wei, Chief Executive Officer of TSMC.
Technology Breakthroughs

Technology Progress in 2019
